Mitsubishi Chemical Corporation
Polymer Compounds Business Group
Easy-peel resin
ABOUT
Modic's Easy Peel series is a polyolefin polymer alloy chemically modified with polymerizable vinyl monomers.
This is an adhesive resin used as an easy-peel sealant or modifier. When used as an easy-peel sealant resin for extrusion lamination,
It provides a smooth release and a clean release surface, exhibiting stable peel strength across a wide range of heat sealing temperatures.
FEAUTURE
Features of Modic™ Peelable
Modic™ Easy-Peel Resin
Modic™ Peelable offers three types (X, Y, and Z) optimized for different types of substrates.
● It is primarily used as a lid material for food containers and as an easy-peel sealant for food packaging.
●It is also used in electronic packaging and medical packaging.
●It can be used not only as a lid for containers, but also as an easy-peel sealant for bonding films together.
● Provides a smooth peeling sensation and a clean peeled surface.
X type: For PP adherends
Designed as a lid material for polypropylene (PP) containers, it features high heat resistance and is available in multiple grades with melting points ranging from 109 to 142°C.
We also offer products suitable for retort packaging (121°C and above). Through cohesive or interfacial delamination, it achieves excellent transparency and sealing properties for applications such as jelly, pudding, rice dishes, and curry.
Y-type: For PE substrates
Optimized for polyethylene (PE) containers and PE-coated paper containers, it features a smooth release. A boil-safe grade is also available.
It can also be used for sealing the surfaces of films together. In addition to packaging for yogurt, instant foods, and confectionery, it can also be used for medical packaging.
Z-type: For multiple substrates
This highly versatile type can be used on a wide range of substrates, includingPS(polystyrene),PET,PVC, andPP.
It achieves high transparency primarily through interfacial peeling, making it ideal for applications where visibility is crucial, such as yogurt and beverage containers.
It can also be used for applications other than food, such as cover tapes for electronic components.
Product lineup and physical properties table
- X-type (for PP substrates) / Y-type (for PE substrates)
- Z-type (for multiple substrates)
X-type (for PP substrates) / Y-type (for PE substrates)
item | Reference Test Methods | unit | X151F | X241F | X252F | X340F | Y024 |
MFR (190℃, 21.2N) | JIS K7210 | g/10min | 2.1 | 2.7 | 5.0 | 5.6 | 4.7 |
Density | JIS K7112 | g/cm³ | 0.91 | 0.90 | 0.91 | 0.91 | 0.94 |
Melting point (DSC peak temperature) | MCC | ℃ | 109 | 140 | 142 | 140 | 103 |
Practical heat resistance temperature | <100℃ | <121℃ | ≧121℃ | <121℃ | <121℃ | ||
Peel strength (N/15mm) | Weak to medium | Weak to medium | Weak to medium | Weak to medium | weak | ||
Peeling morphology | interface | agglomeration | agglomeration | agglomeration | agglomeration | ||
Recommended molding process | inflation | ● | ● | ● | |||
Cast (T-Die) | ● | ● | ● | ● | ● | ||
Extruded lamination | ● | ● | |||||
Food hygiene in major countries (As of April 2025**) | Japan Food Sanitation Law PL 2025~ | Included | Included | Included | Included | Included | |
China GB | Included | Included | Included | Included | Included | ||
FDA (Food category/temperature category) | ALL/CG | ALL/CG | ALL/CG | ALL/ALL | III, IV-A, V, VII-A, IX /CH | ||
EU PAM | Included | Included | Included | Included | Included | ||
Z-type (for multiple substrates)
item | Reference Test Methods | unit | Z050F | Z051F | Z200F | Z400F |
MFR (190℃, 21.2N) | JIS K7210 | g/10min | 2.6 | 2.4 | 18 | 2.0 |
Density | JIS K7112 | g/cm³ | 0.90 | 0.93 | 0.92 | 1.10 |
Melting point (DSC peak temperature) | MCC | ℃ | 104 | 100 | 106 | 120 |
Practical heat resistance temperature | <100℃ | <121℃ | <100℃ | <100℃ | ||
vs A-PET | Peel strength (N/15mm) | weak | Medium | Medium to strong | Weak to medium | |
Peeling morphology | interface | interface | interface | Agglomeration*** | ||
vs HIPS | Peel strength (N/15mm) | weak | Medium to strong | Medium to strong | Medium to strong | |
Peeling morphology | interface | interface | interface | interface | ||
Recommended molding process | inflation | ● | ● | ● | ||
Cast (T-Die) | ● | ● | ● | ● | ||
Extruded lamination | ● | |||||
Food hygiene in major countries (As of April 2025**) | Japan Food Sanitation Law PL 2025~ | Included | Included | Included | Included | |
China GB | Included | Included | Included | Included | ||
FDA (Food category/temperature category) | Ⅰ,Ⅱ,Ⅳ-B,Ⅵ-ABC,Ⅶ-B,Ⅷ /CG | I, II, IV-B, VI, VII-B, VIII /CH | ||||
EU PAM | Included | Included | Included | Included | ||
For the export of chemical products, we will check the regulations of each country and then respond regarding whether or not we can provide them.
Please be sure to include information such as the exporting country.
Please note that for some products, we may not be able to offer or provide a different grade.
CASE
Application example
Easy-Peel Sealant
Materials for electric wires
External semiconductive layer free strip material
CONTACT
Before you start worrying about selecting and developing resin materials
Please contact Mitsubishi Chemical.
Polymer Compounds Business Group Products
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The above information is based on the latest available information as of the date of creation and may be revised in the future based on new information.
Furthermore, this information is provided as general technical information and reference material, and we do not guarantee the accuracy or completeness of the content.
Product performance and characteristics may vary depending on usage conditions, processing conditions, etc. The final decision regarding applicability and design is the customer's responsibility.
We will check the regulations of each country regarding the export of chemical products and then respond whether or not we can provide them. Please be sure to include information such as the exporting country.
Depending on the product, we may suggest a different grade or may not be able to provide the product at all.
Mitsubishi Chemical Corporation
Polymer Compounds Business Group
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